Release single tube 3000W LDMOS RF amplifier tube
Launch the second generation macro station MMIC driver
Launch a full range of repeater products
Mass production of Buck Boost chip for terminal PA power supply
1200V/650V second-generation super junction IGBT mass-produced
Batch shipment of 1200V SiC MOS G3 achieved
Batch shipment of IGBT modules for industrial and commercial energy storage
The HPD vehicle specification module mass production line has officially been put into operation
Mass production of ideal diodes for photovoltaic bypass
Launching a single-chip highly integrated BMS AFE chip
Mass production of Copter E001 series single and dual core high-end MCU products

Establish overseas headquarters in Singapore
Release the second generation MMIC small station product
The cumulative shipment of RF amplifier chips has exceeded 200 million pieces
Bulk shipment of diamond copper
650V second-generation super junction IGBT verification sample submission
The production capacity of power modules has been increased to 3 million units
Launching the Copter E001 series of real-time microcontrollers

Establish the Dutch Application Support Center
B1B3 broadband LDMOS MMIC PA mass production and shipment
The cumulative shipment volume of Yaohua RF sealing and testing products (ACS) has exceeded 1 million pieces
Yaohua power module mass production, with an annual output of 600000 units
1200V FS IGBT shipments exceed 10KK
650V first generation super junction IGBT mass-produced
Industrial grade IGBT modules achieve mass production
Establish a fully automated electroplating line

Establish a simulated chip product line
Sub-1G 700W amplifier in mass production
The cumulative shipment of RF amplifier chips has exceeded 100 million pieces
MMIC PA mass production imported overseas major customers CPC annual shipment volume exceeds one million pieces
650V Super Junction IGBT Verification Sample Delivery
Complete the construction of Yaohua IGBT module packaging and testing production line
Successfully developed high-performance MCU test chips

Merge Foshan Huazhi New Materials Co., Ltd
Establish Changsha Yaohua Sealing and Testing Factory and lay out high-power RF sealing and testing business (ACS)
Establish a digital SoC product line
Mass production of LDMOS MMIC small station products
1200V FS IGBT mass production
Start SiC MOSFET chip development

Establish Shanghai R&D Center
Mass production of mMIMO RF power amplifier chip
Initiate the research and development of super junction IGBT chip technology

Certified by ISO9001:2005
The cumulative shipment of RF amplifier chips has exceeded 20 million pieces

Awarded the national high-tech enterprise qualification
LDMOS 4G LTE RF amplifier chip mass production
Mass production of walkie talkie amplifier chip
Initiate the research and development of FS IGBT chip technology, and lay out the new energy track

Mass production of high-power RF amplifier chip for LDMOS GSM base station

Company registration and establishment
Starting with domestic Foundry
LDMOS dedicated line cooperation